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GPS Engineer

Applied Materials2021-01-01Present

Leading image processing and computing modules, creating field troubleshooting tools, and resolving complex opto-mechanical issues.

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Key Highlights
  • Managed image processing and computing modules
  • Resolved complex opto-mechanical issues on-site and at customer FABs
  • Implemented automated data collection for field issue analysis

Applied Materials - GPS Engineer

Leading technical support and tooling development for semiconductor manufacturing equipment.

Key Responsibilities

  • Managed the image processing and computing modules within the team
  • Created various tools to troubleshoot issues in the field
  • Participated in R&D discussions and provided requirements for future developments
  • Resolved complex opto-mechanical issues on-site and at customer FABs

Impact

Data-Driven Field Support

Before: Manual field issue tracking with limited visibility into patterns

After: Automated daily collection feeding into Tableau dashboard used by multiple teams for decision-making

  • Improved time-to-diagnosis for recurring issues
  • Reduced escalations through early pattern detection
  • Dashboard reviewed daily by managers for prioritization

Urgent Alert System

Built monitoring system that surfaces critical lab issues to management in real-time:

  • Faster response to equipment failures
  • Reduced wasted lab time and resources
  • Clear escalation paths for different severity levels

Onboarding Redesign

Designed structured onboarding program for new team members:

  • Consistent ramp experience regardless of mentor availability
  • Defined graduation criteria for independent work readiness
  • Documentation created became permanent team resource

Failure Narrative: Opto-Mechanical Drift Investigation

Encountered persistent imaging drift at a customer site that wasn't responding to standard calibration procedures.

Investigation approach:

  1. Systematic isolation of variables (thermal, mechanical, optical)
  2. Data collection across multiple operating conditions
  3. Correlation analysis against module tolerance specifications

Root cause: Module tolerance stack-up causing misalignment under specific thermal conditions

Resolution: Implemented monitoring script to detect early drift signatures and established calibration schedule tailored to operating environment

Outcome: Reduced recurrence and faster diagnosis of similar issues

Technologies & Tools

SolidWorks Composer, Tableau, Python scripting, Image Processing systems, Database design